This application note is for engineers who design and develop surface mount technology (SMT), printed circuit boards (PCB), or flexible printed circuits (FPC) for ball grid array (BGA) packaged devices.
These guidelines document the best practices for PCB/FPC design and assembly when using BGA-packaged devices. Because many factors influence manufacturing, performance, and reliability, validate these guidelines using your own product development and qualification processes. The following are the major influencing factors:
- PCB/FPC and solder/flux material
- Manufacturing equipment
- Application-specific requirements