Introduction
Cypress is now offering its PSoC 3 and PSoC 5LP family of products in wafer-level chip scale packages (WLCSPs, or CSPs for short). These devices are designed to pack the maximum mixed-signal SoC capability per cubic millimeter. They feature package sizes as small as 4.25 × 4.98 × 0.6 mm to fit into tiny spaces on very small PCBs or flexible printed circuits (FPCs). However, their small size mandates special manufacturing techniques and design considerations.